| 发明名称 | Integrated circuits with internal pads | ||
| 摘要 | An embodiment includes an integrated circuit, comprising: a substrate; a first circuit formed on the substrate and coupled to a plurality of first pads on the substrate; and a second circuit formed on the substrate and coupled to a plurality of second pads on the substrate. The first pads are formed on a perimeter of the substrate; and the second pads extend from the perimeter of the substrate towards an interior of the substrate. | ||
| 申请公布号 | US9391032(B2) | 申请公布日期 | 2016.07.12 |
| 申请号 | US201414267872 | 申请日期 | 2014.05.01 |
| 申请人 | SAMSUNG ELECTRONICS CO., LTD. | 发明人 | Koog Young;Wang Jiankang;Gill Harpreet;Min Sunghwan |
| 分类号 | H01L23/00;H01L23/495;H01L23/522 | 主分类号 | H01L23/00 |
| 代理机构 | Renaissance IP Law Group LLP | 代理人 | Renaissance IP Law Group LLP |
| 主权项 | 1. An integrated circuit, comprising: a substrate; a first circuit formed on the substrate and coupled to a plurality of first pads on the substrate; and a second circuit formed on the substrate and coupled to a plurality of second pads on the substrate; wherein: the first pads are formed on a perimeter of the substrate;the second pads extend from the perimeter of the substrate towards an interior of the substrate; andeach of the first circuit and the second circuit comprises: a plurality of input/output interfaces; andmemory control logic; a third circuit; and a channel extending through the second pads; wherein the first circuit and the second circuit are operationally coupled through the channel. | ||
| 地址 | KR | ||