| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED lamp having a high heat dissipating capacity from an LED chip, for obtaining a sufficient amount of light with less power consumed and for emitting a surface light. <P>SOLUTION: The LED lamp A1 includes a plurality of LED chips 11 and a substrate 20 on which the plurality of LED chips 11 are directly mounted. <P>COPYRIGHT: (C)2010,JPO&INPIT |
