发明名称 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an excellent positive resist composition exhibiting a sufficiently preferable contrast by exposure to EUV light, causing no problem of outgas during exposure, and having a decreased development defect, and to provide a pattern forming method using the composition. <P>SOLUTION: The positive resist composition contains a resin having a repeating unit of a specified structure and having the solubility with an alkali developing solution increased by an action of an acid, and a sulfonium salt compound of a specified structure generating an acid by an action of EUV light. The pattern forming method is carried out by using the above composition. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006267368(A) 申请公布日期 2006.10.05
申请号 JP20050083424 申请日期 2005.03.23
申请人 FUJI PHOTO FILM CO LTD 发明人 SHIRAKAWA KOJI
分类号 G03F7/039;G03F7/004;H01L21/027 主分类号 G03F7/039
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