| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve accuracy in alignment of substrates and masks after a second layer. <P>SOLUTION: For a substrate W transported to a substrate stage 2 from a prealignment device 50 and retained on the substrate stage 2, a deviated quantity from the center of a field in an alignment camera 30 of an alignment mark 40 printed by a first exposure on the substrate W is found to compensate the position of a next substrate W on the prealignment 50 side based on the deviated quantity. <P>COPYRIGHT: (C)2007,JPO&INPIT |
