| 摘要 |
PROBLEM TO BE SOLVED: To suppress or control the generation of a black powder, which is an oxide remaining on the surface of tin, after a tin plating step of a copper alloy material.SOLUTION: A tin plating method for a copper alloy material includes the steps of: electrolytically degreasing a copper alloy material to be plated with tin; acid-washing the electrically degreased copper alloy material; immersing the acid-washed copper alloy material in a copper substrate plating solution to subject it to copper substrate plating; preliminarily immersing the copper alloy material, having been subjected to the copper substrate plating, in a preliminary immersion liquid; plating the preliminarily immersed copper alloy material with tin; flux-treating the tin-plated copper alloy material with an antioxidant at 5-30°C for 5-10 s; reflow-treating the obtained copper alloy material at 500-600°C for 1-3 min; and drying the obtained copper alloy material at 100-300°C for 1-5 min. In the flux step, the antioxidant is injected by a mist injection method.SELECTED DRAWING: Figure 1 |
