| 发明名称 |
A METHOD FOR BONDING SUBSTRATES USING A UV RADIATION CURING-REDOX CURING ADHESIVE SYSTEM |
| 摘要 |
The present invention provides a method for bonding two substrates using a UV radiation curing-redox curing adhesive system having a shadow area and a transparent area, comprising: bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators. |
| 申请公布号 |
EP2736720(B1) |
申请公布日期 |
2016.09.07 |
| 申请号 |
EP20120817262 |
申请日期 |
2012.07.18 |
| 申请人 |
HENKEL AG & CO. KGAA;HENKEL IP & HOLDING GMBH |
发明人 |
ATTARWALA, SHABBIR;ZHOU, NICOLAS;YUAN, JIMMY;LU, DAOQIANG;SONG, CHONGJIAN |
| 分类号 |
B32B37/12;C08K5/14;C08K5/17;C09J5/04;C09J5/06;C09J11/06;G06F3/044 |
主分类号 |
B32B37/12 |
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