| 摘要 |
According to embodiments, a method of selectively ablating an optically transparent material covering a metal layer of a device may comprise: providing a layer of optically transparent material on a metal layer; and irradiating a portion of the layer of optically transparent material with a defocused or shaped laser beam and ablating the portion of the layer of optically transparent material; wherein the ablating leaves the metal layer completely intact and wherein the laser light has a wavelength within a range of 355 nm to 1070 nm and wherein the layer of optically transparent material absorbs less than or equal to 50% of the laser light from the laser beam on a single pass of the laser light through the layer of optically transparent material. Apparatus for laser ablation of a layer of transparent material on a metal layer, while leaving the metal layer completely intact are described. |
