| 发明名称 |
Cleavable diepoxide for removable device protection in electronic packaging |
| 摘要 |
<p>Chips mounted into substrates are often encapsulated with a cured epoxy which is insoluble. The invention herein is the discovery that diepoxides with ketal linkages are soluble. This permits encapsulating chips, testing them for goodness and removing the chips for rework by dissolving the epoxy without destroying the chip or substrate. <IMAGE></p> |
| 申请公布号 |
EP0532896(B1) |
申请公布日期 |
1997.03.19 |
| 申请号 |
EP19920113569 |
申请日期 |
1992.08.10 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BUCHWALTER, STEPHEN L.;KOSBAR, LAURA L.;NEWMAN, BERT H.;POMPEO, FRANK L. |
| 分类号 |
C08G59/02;C07D303/24;C08G59/00;C08G59/18;C08G59/22;C08G59/24;C08G59/42;C08G59/50;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08G59/22;C07D303/00;H01L23/16 |
主分类号 |
C08G59/02 |
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