| 摘要 |
<p>A photoreactive hot-melt adhesive which, even without incorporation of a polyester which is solid at ordinary temperature thereinto, comes to have a high adhesion strength immediately after bonding, has an excellent adhesion strength after completion of curing, and gives a bonded object having excellent durability. The photoreactive hot-melt adhesive composition comprises (a) a bisphenol F epoxy resin which is solid at ordinary temperature, (b) a compound having a polyoxyalkylene group in the main chain and a hydroxyl, epoxy, or C1-8 alkoxyl group at an end, and (c) a cationic photopolymerization initiator.</p> |
