COMPOSITION FOR FORMING PROTECTING FILM ON WIRING OF SUSPENSION SUBSTRATE FOR HARD DISC AND USE OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a composition for forming a film to protect a wiring such as of copper, etc., formed on a suspension substrate for a hard disc, and a dry film for forming the protecting film of the wiring by using the same. SOLUTION: This composition for forming the protecting film of the wiring of the suspension substrate of the hard disc is characterized by containing (A) a polyimide precursor, (B) a (meth)acrylate compound having at least≥2 photopolymerizable unsaturated double bonds and (C) a photopolymerization initiator. COPYRIGHT: (C)2005,JPO&NCIPI