摘要 |
<p>A metal wiring method for an undercut in a MEMS packaging process includes disposing a MEMS element on a silicon substrate, welding a glass wafer to an upper portion of the silicon substrate having the MEMS element disposed thereon, the glass wafer having a hole formed therein for connecting a metal wiring, depositing a thin metal film for the metal wiring in the hole, and ion-milling the deposited thin metal film. By the ion-milling, the method is capable of connecting a metal wiring to a via hole having an undercut. <IMAGE></p> |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHONG, CI-MOO;CHUNG, SEOK-WHAN;KANG, SEOK-JIN;LEE, MOON-CHUL;JUNG, KYU-DONG;KIM, JONG-SEOK;JUN, CHAN-BONG;HONG, SEOG-WOO;KANG, JUNG-HO |