发明名称 CHEMICALLY AMPLIFIED PHOTORESIST COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a chemically amplified photoresist composition which forms a pattern excellent in shape and line edge roughness. <P>SOLUTION: The chemically amplified photoresist composition includes an acid generator represented by formula (I), and a resin having a structural unit represented by formula (II), wherein Q<SP>1</SP>and Q<SP>2</SP>represent F or 1-6C perfluoroalkyl; X<SP>0</SP>represents a divalent 1-17C saturated hydrocarbon group; Y<SP>1</SP>represents a 3-36C saturated cyclic hydrocarbon group; R<SP>1</SP>represents halogen atom or methyl; X<SP>2</SP>represents a single bond or -[CH<SB>2</SB>]<SB>k</SB>-, k represents an integer of 1-8; and Y<SP>2</SP>represents a 4-36C saturated cyclic hydrocarbon group. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010140014(A) 申请公布日期 2010.06.24
申请号 JP20090245301 申请日期 2009.10.26
申请人 SUMITOMO CHEMICAL CO LTD 发明人 ICHIKAWA KOJI;SHIGEMATSU JUNJI;YOSHIDA ISAO
分类号 G03F7/039;C07C309/12;C07C309/17;C07C381/12;C08F20/10;G03F7/004;G03F7/38;H01L21/027 主分类号 G03F7/039
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