发明名称 Resin tablet for plastic encapsulation and method of manufacturing of plastic encapsulation using the resin tablet
摘要 The present invention provides a resin tablet for plastic encapsulation molding by the transfer molding process. A tablet body is obtained by compressing powdered thermosetting resin and is covered by a covering membrane. A method of manufacturing a plastic encapsulation using such a resin tablet includes exposing the surface of tablet body by breaking the covering membrane in a pot and pressing the thermosetting resin of exposed tablet body with the plunger for encapsulated molding.
申请公布号 US5043199(A) 申请公布日期 1991.08.27
申请号 US19890429475 申请日期 1989.10.31
申请人 FUJITSU LIMITED 发明人 KUBOTA, AKIHIRO;YOSHIDA, SHITOSHI;SATO, SHIGERU;TUNODA, KIYOSHI;YAMAUCHI, OSAMU
分类号 B29B11/04;B29C45/46;B29C67/00;H01L21/56 主分类号 B29B11/04
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