METHOD OF EMBEDDING PASSIVE DEVICE INTO EXTERNAL LAYER FOR PRINTED CIRCUIT BOARD,申请号KR20060077911-传众专利搜索

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发明名称	METHOD OF EMBEDDING PASSIVE DEVICE INTO EXTERNAL LAYER FOR PRINTED CIRCUIT BOARD
摘要
申请公布号	KR100858054(B1)	申请公布日期	2008.09.10
申请号	KR20060077911	申请日期	2006.08.18
申请人		发明人
分类号	H05K3/30	主分类号	H05K3/30
代理机构		代理人
主权项
地址

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