发明名称 |
SEMICONDUCTOR PACKAGE HAVING INTEGRATED METAL PARTS FOR THERMAL ENHANCEMENT |
摘要 |
A semiconductor device comprising a metallic leadframe ( 103 ) with a first surface ( 103 a) and a second surface ( 103 b). The leadframe includes a chip pad ( 104 ) and a plurality of segments ( 107 ); the chip pad is held by a plurality of straps ( 105 ), wherein each strap has a groove ( 106 ). A chip ( 101 ) is mounted on the chip pad and electrically connected to the segments. A heat spreader ( 110 ) is disposed on the first surface of the leadframe; the heat spreader has its central portion ( 110 a) spaced above the chip connections ( 108 ), and also has positioning members ( 110 b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed. |
申请公布号 |
EP1769538(A4) |
申请公布日期 |
2009.01.07 |
申请号 |
EP20050789005 |
申请日期 |
2005.06.20 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
COYLE, ANTHONY;BOYD, WILLIAM, D.;HAGA, CHRIS;SWANSON, LELAND, S. |
分类号 |
H01L29/02;H01L23/10;H01L23/433;H01L23/495 |
主分类号 |
H01L29/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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