| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition capable of making film, excellent in high frequency property and embedding properties between metal wiring patterns and having low thermal expansion coefficient.SOLUTION: There is provided a resin composition containing (A) a thermosetting resin having a styrene group at a terminal and molecular weight of 800 to 1500, (B) a liquid epoxy resin, (C) a styrenic thermoplastic elastomer, (D) a filler and (E) a curing agent and (D) is 30 to 70 pts.wt. based on 100 pts.wt. of the resin composition.SELECTED DRAWING: None |
