| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a decrease in resin sealing effect due to breakage etc., of a resin sealing portion during heat curing by preventing a void into which a sealing resin is not inserted from being formed in the bottom portion of a clearance between the external wall of the conventional semiconductor device and the internal wall of a recessed portion of a substrate. <P>SOLUTION: After a first sealing resin portion 5 is arranged which covers the semiconductor device 1, a first degassing process, a second sealing resin portion arranging process of arranging a second sealing resin portion 7 from the surface side of a mask 6 and moving a squeegee 8 along the surface of the mask 6 to charge a resin sealing portion 3 on the surface of the substrate 1 and in the bottom of the clearance 9 between the external wall 1b of the semiconductor device 1 and the internal wall 2c of the recessed portion 2a, and a second degassing process are carried out. Consequently, the resin sealing portion 3 is charged up to the bottom portion of the clearance 9 to remove gas, so the resin sealing portion 3 is never broken even in the heat curing process to obtain excellent sealing effect. <P>COPYRIGHT: (C)2010,JPO&INPIT |
