| 发明名称 |
Integrated circuit heat spreader stacking method |
| 摘要 |
An integrated circuit heat spreader stacking system is provided including mounting an integrated circuit on a substrate, forming a heat spreader, forming a stacking stand-off for the heat spreader, and mounting a heat spreader over the integrated circuit.
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| 申请公布号 |
US7759169(B2) |
申请公布日期 |
2010.07.20 |
| 申请号 |
US20060456846 |
申请日期 |
2006.07.11 |
| 申请人 |
STATS CHIPPAC LTD. |
发明人 |
FILOTEO, JR. DARIO S.;ESPIRITU EMMANUEL;CABLAO PHILIP LYNDON |
| 分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
| 代理机构 |
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