| 摘要 |
A vibration gyro which is a sensor circuit module includes a packaging substrate, a vibrator mounted on the substrate, a chip type semiconductor element mounted by flip-chip bonding, a chip element, and a cover. The portion of the end surfaces of the packaging substrate in which no through-hole terminals are formed is coated with a light-shielding coating material which is a light-transmission-stopping member. Preferably, the color of the light-shielding coating material is as dark as possible, and is black, if possible. |
