Electronic Part And Method Of Producing The Same

摘要

An electronic component is provided with a base member 1 having a through hole 41 ( 43 ) extending from a bottom surface of a recess 15 to a back surface 11 _back, an electronic element 4 mounted in the recess 15 , a lid member 2 closing an aperture of the recess 15 , and an adhesive 3 ( 42 ) interposed between the lid member 2 and an opening end face of the recess 15 , and obstructing the through hole 41 ( 43 ) to keep an interior space of the recess in a hermetically-sealed state; the adhesive 3 ( 42 ) obstructs a space between the lid member 2 and the base member 1 , and the adhesive 3 ( 42 ) finally also obstructs the through hole 41 ( 43 ) extending from the bottom surface of the recess 15 to the back surface 11 _back so as to allow air, which could inhibit the obstruction, to escape during production. Since the inhibition of adhesion with the adhesive 3 ( 42 ) due to air is prevented in this manner, positional deviation and adhesion failure are suppressed and the obstruction with the adhesive achieves better hermetic sealing in the recess than before. This effect is prominent, particularly, in cases of materials having a plurality of recesses.