Semiconductor component manufacturing process, involves delivering liquid filling material between support plate and each chip such that material fills space between portion of plate and chip, after hardening

摘要

The process involves fixing an IC chip (6) on front side of each portion of a support plate by electrical connection balls (7). A hardening liquid filling material (9) is delivered between the plate and each chip such that the material fills a space between each portion and each chip, after hardening. The portions are separated to constitute semiconductor components (1), after hardening of the filling material. The connection balls are connected to electrical connection zones of front side of the support plate and to electrical bonding pad of rear side of the chip. An independent claim is also included for a semiconductor component.