METHOD FOR MANUFACTURING COMPOUND MATERIAL WAFERS AND METHOD FOR RECYCLING A USED DONOR SUBSTRATE

摘要

A method for manufacturing a compound material wafer and a method for recycling a used donor substrate are provided to improve a recycling rate of the used donor substrate and to economize fabrication costs by removing precipitates and nuclei in the process using one-time heat treatment. An insulating layer(5) is formed on the initial donor substrate(1). An isolation region(7) is formed in an initial donor substrate. The initial donor substrate is attached to a handle substrate(9). A predetermined layer of the initial donor substrate is transferred to the handle substrate to form a compound wafer. One-time heat treatment is performed on the initial donor substrate to reduce partially oxygen precipitates and nuclei in residues(13) of the initial donor substrate.