| 摘要 |
PROBLEM TO BE SOLVED: To reduce current unbalance between semiconductor devices in the semiconductor stack of a power conversion device. SOLUTION: A wiring board 3 is constituted as a three-layered structure consisting of an alternating-current terminal layer U, a positive-pole terminal layer P, and a negative-pole terminal layer N. These layers are arranged in proximity to one another and in parallel with one another, in such a manner that the direction of currents flowing from the positive-pole terminal layer P to the alternating-current terminal layer U is opposite to the direction of the currents flowing from the alternating-current terminal layer U to the negative-pole terminal layer N. Thereby the field interferences of the semiconductor devices with each other is eliminated, and a current unbalance is reduced. Number 2 in the figure refers to a base on which the semiconductor devices 1 are to be mounted. |
