| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To realize reduction of an electric wiring area in a PLC (Planar Lightwave Circuit) substrate, reduction of a module size by dispensing with IC mounting substrate, reduction of the number of wire bonding lines between the PLC substrate and an electronic circuit board and simplification of an inspection process in an optical module for controlling output characteristics with electricity. <P>SOLUTION: An optical waveguide circuit (PLC) and an electronic circuit (IC) 109 to drive the PLC are directly mounted on an identical substrate 101. The IC109 is not resin sealed, but a bare chip is directly mounted and is subsequently sealed. By grouping and concentrating wiring lines of the IC109 on the PLC substrate, the optical module is made to be high-density and is downsized. <P>COPYRIGHT: (C)2004,JPO</p> |
