发明名称 |
CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF |
摘要 |
The present invention relates to a chip electronic component comprising a magnetic material main body where an inner coil unit is embedded therein, with improved dispersibility and a filling rate of metal magnetic material powder. The magnetic material main body includes: the metal magnetic material powder; a thermosetting resin; and a color former. |
申请公布号 |
KR20160057748(A) |
申请公布日期 |
2016.05.24 |
申请号 |
KR20140158747 |
申请日期 |
2014.11.14 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK, JEONG HYUN;PARK, KI HYUN;LEE, KYU HO |
分类号 |
H01F17/00;H01F27/28;H01F41/04 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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