发明名称 CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 The present invention relates to a chip electronic component comprising a magnetic material main body where an inner coil unit is embedded therein, with improved dispersibility and a filling rate of metal magnetic material powder. The magnetic material main body includes: the metal magnetic material powder; a thermosetting resin; and a color former.
申请公布号 KR20160057748(A) 申请公布日期 2016.05.24
申请号 KR20140158747 申请日期 2014.11.14
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, JEONG HYUN;PARK, KI HYUN;LEE, KYU HO
分类号 H01F17/00;H01F27/28;H01F41/04 主分类号 H01F17/00
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