发明名称 |
VARIABLE HEAT CONDUCTOR |
摘要 |
A method and apparatus for a variable heat conductor that is able to increase heat conduction capacity based on operating temperature. The variable heat conductor is to be positioned between an electronic device and a heat sink to facilitate cooling of the electronic device. During cold start-up of the electronic device, the variable heat conductor acts as a thermal isolator, causing the electronic device to warm more quickly following the cold start-up. The variable heat conductor may fully conduct heat at higher temperatures that are at or above a desired temperature set-point. |
申请公布号 |
US2016233143(A1) |
申请公布日期 |
2016.08.11 |
申请号 |
US201315022108 |
申请日期 |
2013.09.20 |
申请人 |
GE INTELLIGENT PLATFORMS, INC. |
发明人 |
Sporer Bernd;Hortmann Philipp Gerhard |
分类号 |
H01L23/373;H01L21/48 |
主分类号 |
H01L23/373 |
代理机构 |
|
代理人 |
|
主权项 |
1. A variable heat conductor, comprising:
a first major body being made from a first material; a second major body contacting the first major body, the second major body being made from the first material; and an expansion material being anchored to the first major body, a distal end of the expansion material and an inner surface of the second major body defining a gap, the expansion material being made from a second material, the second material having a higher rate of thermal expansion than the first material. |
地址 |
Charlottesville VA US |