| 摘要 |
PROBLEM TO BE SOLVED: To grind a wafer without using a protective member.SOLUTION: A grinding device (1) comprises: a chuck table (3) that holds a wafer (W); a negative pressure generation part (32) that generates a negative pressure on a holding surface (31) of the chuck table; grinding means (2) for grinding a top face of the wafer; and a plurality of support rollers (4) that support an outer edge of the wafer and auto-rotate. The wafer is held in a non-contact manner while spacing the holding surface and a bottom face of the wafer, and the wafer is ground by the grinding means while rotating the wafer in contact with the support rollers by auto-rotating the support rollers.SELECTED DRAWING: Figure 2 |
