| 摘要 |
A method for the detection of defects on surfaces of single wafer or any other single flat object, is characterized by the steps of: taking digital image of the inspected portion of the surface; generating a first processed image by plurality of applications of themorphologic operator Erode or Dilate on all image points of the image; generating second processed image by further one or more applications of the operator used in step (b) on the image generated in previous step; generating third processed image by calculating the difference or the quotient of the brightness values on each of the image points of the first and second processed image; filtering of image ranges with brightness values outside of threshold range. |
