| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a gallium nitride-based LED device capable of improving a thermal resistance characteristic and reliability by using, as an adhesive layer, a plurality of metallic layers each formed of a single element in joining an LED chip to a submount, and applying a soldering process to each of them. <P>SOLUTION: This gallium nitride-based LED device includes: the LED chip 100; and the submount 200 eutectic-bonded with the LED chip 100 through the adhesive layer 300, wherein the adhesive layer 300 is configured by soldering a plurality of metallic layers in which a first metallic layer 310 and a second metallic layer 320 are sequentially stacked, and the second metallic layer 320 is formed in a paste form. <P>COPYRIGHT: (C)2009,JPO&INPIT |
