| 摘要 |
A plurality of chips arranged on a substrate properly bond to the substrate. A bonding apparatus (1030) comprises: a process chamber having an upper chamber (1101) and a lower chamber (1102); a sealant (1103) circularly provided between the upper chamber (1101) and the lower chamber (1102); an arranging plate provided inside the process chamber, and arranging a wafer; a heating device provided in the arranging plate, and heating the wafer; and a gas supply device for supplying pressurizing gas inside the process chamber. The sealant (1103) is in contact with the upper chamber (1101) and the lower chamber (1102). In addition, the upper chamber (1101) and the lower chamber (1102) are provided not to be in contact with each other. |
