| 摘要 |
<p>Provided is an epoxy resin having superior solvent dissolving properties and having a curing product having high thermal conductivity. The epoxy resin is obtained by causing the reaction, with the amount of epoxy resin being a stoichiometric surplus, of: a phenol compound obtained by reacting at least one compound represented by formulae (1)-(5) and a compound represented by formula (6) (in the formulae: R1 represents a hydrogen atom, an alkyl group having 1-10 carbon atoms, or the like; R2 represents a hydrogen atom or an alkyl group having 1-20 carbon atoms; R3 represents a hydrogen atom, an alkylcarbonyl group having 0-10 carbon atoms, or the like; R12 represents a hydrogen atom, an alkyl group having 1-20 carbon atoms, or the like; R13 represents a hydrogen atom, an alkyl group having 1-20 carbon atoms, or the like; and R4 represents a hydrogen atom, an alkyl group having 1-10 carbon atoms, or the like); and the epoxy resin obtained by reacting an epihalohydrin with the phenol compound.</p> |
