METHOD AND CIRCUITS FOR COMMUNICATION IN MULTI-DIE PACKAGES

摘要

Various example implementations are directed to circuits and methods for inter-die communication on a multi-die integrated circuit (IC) package. According to an example implementation, an IC package includes a first semiconductor die having a plurality of communication circuits for communicating data over respective data terminals of the package. The package also includes a second semiconductor die having N contacts for communicating data to and from the semiconductor die. The second semiconductor die includes a logic circuit configured to communicate M parallel data signals with one or more other semiconductor dies of the package, wherein M>N. The second semiconductor die also includes a plurality of serializer circuits, each configured to serialize data from a respective subset of the plurality of the M signal lines to produce serialized data and provide the serialized data to a respective one of the contacts.

主权项

1. An apparatus, comprising:
a first semiconductor die; M signal lines on the semiconductor die; a logic circuit on the semiconductor die, the logic circuit configured to communicate M data signals, via the M signal lines, with one or more semiconductor dies communicatively coupled to the first semiconductor die; a plurality of contacts on the semiconductor die including at least N contacts, wherein the number of N contacts is less than the number of M signal lines and each contact is coupled to another one of the one or more semiconductor dies via a respective signal path; and a plurality of serializer circuits on the first semiconductor die, each configured to serialize data from a respective subset of the plurality of the M signal lines to produce serialized data and provide the serialized data to a respective one of the contacts.