Semiconductor device and method of fabricating same

摘要

A lateral drain metal oxide semiconductor (LDMOS) device includes a well region having a second conductive type in a substrate, a body region having a first conductive type in the well region, a drift region having the second conductive type in the well region and spaced apart from the body region, a source region having the second conductive type in the body region, a drain region having the second conductive type in the drift region, a gate structure on the well region between the source region and the drain region, a shallow trench isolation (STI) structure in the drift region between the drain region and the source region, and a buried layer having the first conductive type in the well region under the drift region, a center of the buried layer being aligned with a center of the STI structure.

主权项

1. A method of manufacturing a transistor, comprising:
forming a trench in a substrate; implanting a first dopant having a first conductive type into the substrate in a direction perpendicular to a major surface of the substrate by utilizing edges of the trench as an implantation mask, to form a buried layer under a bottom surface of the trench; implanting a second dopant having a second conductive type into the substrate at various implant angles with respect to the direction perpendicular to the major surface of the substrate, to form a drift implantation layer along side walls and the bottom surface of the trench; and depositing a dielectric material in the trench.