COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR FABRICATING PRINTED WIRING BOARD

摘要

Provided is a copper foil provided with a carrier which enables, in a laminate produced by laminating a copper foil provided with a carrier on a resin substrate, to peel the ultrathin copper layer from the carrier well. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein, when the surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, the ten point average roughness Rz of the surface is 6.0 μm or less.

主权项

1. A copper foil provided with a carrier comprising, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein at least one of the following (i-a) to (iii-a) is satisfied:
(i-a) when a surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, a ten point average roughness Rz of the surface is 6.0 μm or less; (ii-a) when a surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, an arithmetic average roughness Ra of the surface is 1.0 μm or less; (iii-a) when a surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-2001, a maximum cross-sectional height Rt in a roughness curve of the surface is 7.0 μm or less.