METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EMBEDDING SUBSTRATE AND ELECTRONIC COMPONENT EMBEDDING SUBSTRATE

摘要

Disclosed herein are a method for manufacturing an electronic component embedding substrate and an electronic component embedding substrate. The method for manufacturing an electronic component embedding substrate includes: inserting an electronic component into a cavity formed in a core substrate; stacking a first insulating layer on one side of the core substrate into which the electronic component is inserted; performing surface treatment on the other side of the core substrate opposite to a direction in which the first insulating layer is stacked to improve a surface roughness of at least an exposed surface of the first insulating layer; and stacking a second insulating layer on the other side of the core substrate so as to be bonded to the exposed surface of the first insulating layer of which the surface roughness is improved. In addition, disclosed herein is the electronic component embedding substrate.

主权项

1. An electronic component embedding substrate comprising:
a core substrate having a cavity formed therein; an electronic component inserted into the cavity; a first insulating layer stacked on one side of the core substrate into which the electronic component is inserted; a second insulating layer stacked on the other side of the core substrate opposite to a direction in which the first insulating layer is stacked; and a bonding interface formed by bonding the first and second insulating layers to each other in the cavity and having an improved interface roughness.