| 发明名称 |
DEVICE FOR DISSIPATING HEAT FROM AT LEAST ONE ELECTRONIC COMPONENT |
| 摘要 |
The current embodiments provide an assembly for cooling a printed circuit board with at least one electronic component disposed on a first surface of the printed circuit board. The assembly may have a housing with first and second elastic elements and a cooling element configured to cool the at least one electronic component. The printed circuit board may be held between the first and second elastic elements in the housing. The assembly may further have at least one cooling surface region protruding from the cooling element and facing toward a second surface facing opposite the first surface of the printed circuit board in a region opposite of the electronic component. |
| 申请公布号 |
US2016212835(A1) |
申请公布日期 |
2016.07.21 |
| 申请号 |
US201614997177 |
申请日期 |
2016.01.15 |
| 申请人 |
ZF Friedrichshafen AG |
发明人 |
Müeller Karl-Heinz;Held Matthias;Hüebner Horst |
| 分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An assembly for cooling a printed circuit board comprising at least one electronic component disposed on a first surface of the printed circuit board, the assembly comprising:
a housing having first and second elastic elements and a cooling element configured to cool the at least one electronic component; wherein the printed circuit board is held between the first and second elastic elements in the housing; and at least one cooling surface region protruding from the cooling element and facing toward a second surface facing opposite the first surface of the printed circuit board in a region opposite of the electronic component. |
| 地址 |
Friedrichshafen DE |
