SOLDER ATTACH APPARATUS AND METHOD

摘要

An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more electrical connection pads, the connecting structure formed from a second solder having a second melting temperature lower than the first melting temperature. Electronic devices are shown including a polymer mold material formed over the solder structures.

主权项

1. A method, comprising:
coupling a solder ball to an electrical connection pad using a second solder with a second melting temperature lower than a first melting temperature of the solder ball; forming a mold material over the solder ball at a temperature lower than the second melting temperature; and opening a via into the mold material to expose the solder ball.