| 摘要 |
The invention relates to a 3D electronic module comprising a stack (100) of at least a first slice (10) and a second slice (30), the first slice (10) having on a face (101) at least one set (4) of electrically conductive protrusions (41), and the second slice (30) comprising at least one zone (61) of electrically insulating material, traversing the thickness of the slice. The second slice (30) comprises at least one electrically conductive element (3) traversing said slice in a zone (61) of electrically insulating material, able to receive a set (4) of protrusions (41) of the first slice (10).
|
