发明名称 |
PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A STACKED INTEGRATED CIRCUIT PACKAGE |
摘要 |
Packaged integrated circuits and methods to form a thermal stacked integrated circuit package are disclosed. A disclosed method comprises attaching a first integrated circuit to at least one of a plurality of pads of a substrate, mounting a second integrated circuit above the first integrated circuit, placing a heat conductor in thermal contact with a top surface of the second integrated circuit, and encapsulating the first and second integrated circuits while leaving a surface of the heat conductor exposed to dissipate heat. |
申请公布号 |
US2009072373(A1) |
申请公布日期 |
2009.03.19 |
申请号 |
US20070855784 |
申请日期 |
2007.09.14 |
申请人 |
JAVIER REYNALDO CORPUZ;CHIPALKATTI JAYPRAKASH V;LOHIA ALOK K |
发明人 |
JAVIER REYNALDO CORPUZ;CHIPALKATTI JAYPRAKASH V.;LOHIA ALOK K. |
分类号 |
H01L23/02;H01L21/00 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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