| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated electronic component capable of improving the yield, at mounting on a substrate, or the like. Ž<P>SOLUTION: A laminated electronic component 1 comprises: an substantially rectangular parallelepiped laminate 2, in which an insulator layer and a conductor pattern are laminated and in which a coil 3 is formed; end electrodes 4, 5 which are formed on both end surfaces, in a direction of crossing the axial direction of the coil 3 formed in the laminate 2, respectively; and a mark 6 which is formed, along a direction extending from one of the end electrodes to the other on one surface of the laminate 2 crossing the axis direction. The mark 6 is formed so as to cover a portion, having a smaller number of layers which overlap in the laminating direction of the conductor patterns, in a portion where the conductor pattern is formed, as seen from the axial direction. Both ends of the mark 6 in the lengthwise direction of the laminated body 2 are covered by the end electrodes 4, 5 respectively. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
