| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can inhibit a void in a die bond part in a simple process.SOLUTION: In a semiconductor device in which an element fixing surface 101 which is one surface of a semiconductor element is fixed by a solder to a substrate fixing surface 201 which is one surface of a substrate, a distance between the element fixing surface and the substrate fixing surface gradually increases in one direction. The distance is increased by forming projections 4 (diameter of 0.5 mm, height of 0.2 mm) made by epoxy resin on two places by dispenser supply and subsequent heat hardening of the epoxy resin.SELECTED DRAWING: Figure 1 |
