发明名称 3D nonvolatile memory device
摘要 A 3D nonvolatile memory device is disclosed. The 3D nonvolatile memory device includes a word line stack in which a plurality of word lines are stacked therein and includes a cell region and a slimming region, and pass transistors located below the word line stack, and electrically coupled to the slimming region. A width of the slimming region is larger than that of the cell region.
申请公布号 US9419009(B1) 申请公布日期 2016.08.16
申请号 US201514833801 申请日期 2015.08.24
申请人 SK Hynix Inc. 发明人 Oh Sung Lae;Eom Dae Sung
分类号 H01L27/115;H01L23/528 主分类号 H01L27/115
代理机构 IP & T Group LLP 代理人 IP & T Group LLP
主权项 1. A three-dimensional (3D) nonvolatile memory device comprising: a first word line stack including a plurality of first word lines and extending from a first cell region to a first slimming region; and a second word line stack including a plurality of second word lines and extending from a second cell region to a second slimming region, wherein each of the first slimming region and the second slimming region are in a stepped form, and wherein the first slimming region and the second slimming region face each other.
地址 Gyeonggi-do KR