发明名称 |
3D nonvolatile memory device |
摘要 |
A 3D nonvolatile memory device is disclosed. The 3D nonvolatile memory device includes a word line stack in which a plurality of word lines are stacked therein and includes a cell region and a slimming region, and pass transistors located below the word line stack, and electrically coupled to the slimming region. A width of the slimming region is larger than that of the cell region. |
申请公布号 |
US9419009(B1) |
申请公布日期 |
2016.08.16 |
申请号 |
US201514833801 |
申请日期 |
2015.08.24 |
申请人 |
SK Hynix Inc. |
发明人 |
Oh Sung Lae;Eom Dae Sung |
分类号 |
H01L27/115;H01L23/528 |
主分类号 |
H01L27/115 |
代理机构 |
IP & T Group LLP |
代理人 |
IP & T Group LLP |
主权项 |
1. A three-dimensional (3D) nonvolatile memory device comprising:
a first word line stack including a plurality of first word lines and extending from a first cell region to a first slimming region; and a second word line stack including a plurality of second word lines and extending from a second cell region to a second slimming region, wherein each of the first slimming region and the second slimming region are in a stepped form, and wherein the first slimming region and the second slimming region face each other. |
地址 |
Gyeonggi-do KR |