MICROELECTRONIC PACKAGES INCLUDING REACTIVE COMPONENTS, AND METHODS OF FABRICATING THE SAME

摘要

Microelectronic packages include at least one reactive component, such as a capacitor, inductor and/or mutual inductor that may be of fixed or variable value. At least one reactive component is fabricated on a first face of a first substrate. The first face of the first substrate is placed adjacent a second face of a second substrate, with at least one solder bump between the at least one reactive component and the second face. The at least one solder bump is reflowed, to join the at least one reactive component to the second substrate. The reflowing may be followed by releasing the first substrate from the at least one reactive component.