| 摘要 |
<p>To provide more compact dimensions of a via structure formed by signal via pairs and ground vias in multilayer substrate and, also, to increase the isolation of the signal via pairs in the via structure. Also, another object of presented invention is improving impedance control for via structures in the wide frequency band and reduction of transformation between differential and common modes. A multilayer substrate is provided such that the multilayer substrate comprising a high-isolated via cell wherein the high-isolated via cell comprises: two signal via pairs; a shield structure around two signal via pairs consisting of ground vias and ground strips connected to ground vias wherein the shield structure is formed symmetrically in respect to two via pairs to reduce the transformation between mixed modes and also leakage from two signal via pairs; a clearance hole separating signal via pairs from other conductive parts of the multilayer substrate and having predetermined dimensions to provide broadband operation of the high-isolated via cell; and the separating strip disposed symmetrically between said signal via pairs to provide crosstalk reduction between two signal via pairs and common mode decrease.</p> |
