Microelectromechanical Systems Devices with Improved Reliability

摘要

An electronic device may include components that are formed using microelectromechanical systems (MEMS) technology. A MEMS device may include a MEMS structure bonded to a semiconductor substrate. The MEMS structure may be formed from a silicon substrate having a cavity and a moveable member suspended over the cavity and free to oscillate within the cavity. The semiconductor substrate may be a complementary metal-oxide semiconductor substrate having circuitry such as sensing electrodes. The sensing electrodes may be used to gather signals that are produced by movement of the suspended member. One or more of the electrodes on the semiconductor substrate may be covered by a dielectric film to prevent electrical shorts between adjacent electrodes on the semiconductor substrate.

主权项

1. A microelectromechanical systems device, comprising:
a first substrate having a cavity and a member that is anchored to the first substrate and suspended over the cavity; a second substrate having circuitry including an electrode that gathers signals produced by movement of the member; and a passivation layer formed over the electrode.