Semiconductor package

摘要

A semiconductor package includes a plurality of connection pads, which are electrically connected to connection terminals of a mounted component that is mounted on the semiconductor package, and recognition marks. The recognition marks are formed respectively within the area of each of at least two of the connection pads. Each recognition mark has an area that is smaller than the area of the connection mark in which it is formed.

主权项

1. A semiconductor device comprising:
a lower package comprising:
a wiring pattern including exposed parts that function as a plurality of connection pads; anda recognition mark formed in each of at least two of the plurality of connection pads, wherein each said recognition mark has an area less than an area of the corresponding connection pad when viewed from above, and wherein each said recognition mark is a recess or a projection of the corresponding exposed part of the wiring pattern in an outermost surface of the lower package; and an upper package comprising connection terminals configured to be electrically connected to at least some of the plurality of connection pads.