Two-axis vertical mount package assembly

摘要

Vertical mount package assemblies and methods for making the same are disclosed. A method for manufacturing a vertical mount package assembly includes providing a base substrate having electrical connections for affixing to external circuitry, and providing a package having a mounting region configured to receive a device therein. Flexible electrical leads are formed between the base substrate and the package. The flexible leads can include a plurality of aligned grooves to guide bending. After forming the flexible electrical leads, the package is rotated relative to the base substrate. The aligned grooves can constrain the relative positions of the substrates during rotation, and the beveled edges of the base substrate and package can maintain a desired angular relationship (e.g., perpendicular) between the base substrate and the package after rotation.

主权项

1. A vertical mount package assembly comprising:
a base substrate having electrical connections for affixing to external circuitry; a package having a device region configured to receive at least one device; and a plurality of spaced apart electrical leads between the base substrate and the package, wherein the leads include aligned grooves, each groove comprising a surface recess to provide alignment between the base and the package, the grooves being aligned along a crease of the leads.