| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of which the outer shape is made small while taking a junction to a cooling member such as a radiation fin into account in a semiconductor device structure including heat radiation parts on both surfaces.SOLUTION: A semiconductor device comprises: a first radiator having conductivity and a heat dissipation property; a semiconductor element that is mounted on a top face of the first radiator plate; a second radiator that is positioned in an upper part of the semiconductor element and has conductivity; and a resin seal body which seals at least a top face of the first radiator, the semiconductor element and a bottom face of the second radiator. The first radiator and the second radiator are disposed on a bottom face and a top face of the resin seal body and exposed outside of the resin seal body, and the second radiator includes a heat radiation part, a terminal part and a coupling part to be electrically connected with a top face electrode of the semiconductor element. A screw hole is provided in the terminal part of the second radiator plate.SELECTED DRAWING: Figure 1 |
