Devices and methods of packaging semiconductor devices

摘要

Devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a device includes a first semiconductor device and a second semiconductor device coupled to the first semiconductor device. An underfill material is disposed between the first semiconductor device and the second semiconductor device. The underfill material is also disposed on sidewalls of the first semiconductor device and the second semiconductor device. The underfill material has a first thickness on sidewalls of the first semiconductor device and a second thickness on sidewalls of the second semiconductor device. The second thickness is different than the first thickness.

主权项

1. A method of packaging a semiconductor device, the method comprising:
providing a fan-out structure having a first plurality of electrodes; providing a packaged semiconductor device having a second plurality of electrodes; aligning the first and second plurality of electrodes; coupling the packaged semiconductor device to the fan-out structure by their respective electrodes using a plurality of connectors; partially singulating the coupled packaged semiconductor device and fan-out structure along scribe lines disposed proximate sidewalls of the packaged semiconductor device and sidewalls of the fan-out structure; disposing an underfill material between the packaged semiconductor device and the fan-out structure and along the partially singulated scribe lines; and fully singulating the coupled packaged semiconductor device and fan-out structure along the scribe lines to form a packaged semiconductor device.