| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having superior resolving power, contact stability and resist stripping properties, and to provide a photoresist film. <P>SOLUTION: The photosensitive resin composition comprises a polymer, having a carboxyl group (A), an ethylenically unsaturated compound (B) and a photopolymerization initiator (C). The polymer having a carboxyl group (A) is a copolymer, having methacrylic acid (a1), a vinyl monomer having a phenyl group (a2) and a compound represented by Formula (1) (a3) as the copolymerization components, wherein the content of the methacrylic acid (a1) is 22 to 35% by weight, and the content of the vinyl monomer having the phenyl group (a2) is 20 to 35% by weight, both being relative to the total amount of the copolymerization components. <P>COPYRIGHT: (C)2007,JPO&INPIT |
